FEATURES
CTI≥600
Excellent processing performance
Not recommended for solder mask rework
APPLICATIONS
Power base board、TV、Refrigerator、Washing machine,etc.
GENERAL PROPERTIES
Item | IPC-TM-650 | Test Condition | Typical value | ||
Glass transition temp. | DSC | ℃ | 126 | ||
Decomposition Temp. | 2.4.24.6 | TGA | ℃ | 335 | |
T288 | 2.4.24.1 | TMA,unclad | min | 1 | |
Thermal stress | 2.4.13.1 | unclad | sec | 60 | |
Water absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.17 | |
Peel Strength/18μm | 2.4.8 | as received | lb/in | 8.5 | |
after thermal stress | lb/in | 8.5 | |||
Permittivity(RC50%) | 2.5.5.9 | C-24/23/50,1G | / | 4.7 | |
Loss tagent(RC50%) | 2.5.5.9 | C-24/23/50,1G | / | 0.016 | |
Volume resistivity | 2.5.17.1 | C-96/35/90 | MΩ·cm | 2.31*108 | |
Surface resistivity | 2.5.17.1 | C-96/35/90 | MΩ | 2.37*106 | |
Arc Resistance | 2.5.1 | sec | 120 | ||
Dielectric Breakdown | 2.5.6 | D48/50+D0.5/23 | kV | 55 | |
Flexural strength | Warp | 2.4.4 | as received | MPa | 380 |
Fill | 2.4.4 | as received | MPa | 310 | |
Flame resistance | UL-94 | A&E-24/125 | / | V0 | |
CTI | C-96/20/65 | IEC-60112 | Rating | PLC0 | |
u Specimen Thickness:1.6mm.Specification sheet:IPC-4101/12, for reference only.